Forum Speakers

Ross Addinall, Ph.D

Ross has over 18 years’ experience in RF, Analog and Mixed-Signal EDA. He joined Ciranova as European Technical Director in March 2010. Previously he has worked for the industry’s leading companies, including Cadence Design Systems where he held positions as Technical Account Manager specialising in the full custom tool suite and Program Manager for Northern European Services. Before moving into the EDA industry Ross provided EDA and Process Design Kit support for design teams at Lucent Technologies, Rockwell Semiconductor Systems and GEC Plessey Semiconductors in Swindon. Ross has a Ph.D. in Semiconductor Physics from Imperial College.

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Dr. Jalal Bagherli

Dr. Jalal Bagherli joined Dialog Semiconductor in September 2005 as Chief Executive Officer. Prior to joining Dialog Semiconductor, he was Vice President & General Manager for the Mobile Multimedia business unit for Broadcom Corporation and the CEO of Alphamosaic. Dr. Bagherli has extensive experience of the semiconductor industry with a wealth of knowledge about the Far Eastern, European and North American markets, gained through his previous professional and executive positions with Texas Instruments and Sony.

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David Baillie

David Baillie is CEO at CamSemi - an emerging leader in the development and supply of cost-efficient and intelligent AC:DC power management ICs – which is headquartered in the UK with operations in Taiwan, China, Korea and Silicon Valley. The Cambridge-based company has received multiple industry awards for its disruptive technologies and market-leading products that are helping some of the world’s largest consumer electronics brands to develop simpler, smaller, lower cost, and more materials and energy-efficient off-line power conversion products.

David took up his current role in 2004 and has nearly 30 years’ experience in semiconductor companies that have successfully grown from start-up through IPO and on to market-dominant positions. He was the second employee of LSI Logic in Europe and the first for C-Cube Microsystems. He has held a variety of international technical, marketing and sales management positions, based in the UK, Sweden, France and California.

He is a founding member and current chair of the EMEA leadership council for the Global Semiconductor Alliance and has a degree in applied physics and a masters in microelectronics & business studies.

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Stan Boland

Stan Boland is President and CEO of Icera Inc., a company he co-founded in 2002 and which now employs over 300 staff in seven countries around the world.

After an early career with Rolls-Royce, Bell Resources, Bricom and ICL, he joined Acorn Computers in 1997 and was appointed CEO in 1998. In 1999, Boland led the acquisition and VC backing for a spin-out from Acorn to form Element 14 Inc., a company he led and sold to Broadcom Corporation in 2000 for $640M.

Icera has developed a unique soft modem technology - baseband, RF and software- which is supplies to vendors of 3G/4G Mobile Broadband devices, such as USB sticks, modules and, in the future, phones. Its revenues grew by 5x in 2009.

Stan is a Physics graduate from Cambridge University, a qualified accountant and a Member of the IEEE.

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Mike Brinson

Mike Brinson holds a first class honours BSc degree in the Physics and Technology of Electronics from the U.K. Council for National Academic Awards, and a PhD in Solid State Physics from London University. Dr Brinson is A Chartered Engineer (CEng) and a Fellow of the Institute of Engineering and Technology (FIET), a Chartered Physicist (CPhys) and a member of the Institute of Physics. Currently, he is a visiting Professor at the Centre For Communications Technology, London Metropolitan University, U.K. His current research interests centre on the development of software tools for modelling and performance testing of established and emerging semiconductor technologies. Since 2006 Dr Brinson has been a member of the Qucs (Quite universal circuit simulator) development team, specialising in compact device and circuit modelling and testing. Qucs is an open source sourceforge.net project whose primary mission is the development of a circuit simulator software package with integrated GUI, and a compact device and circuit macromodelling tool from DC to RF and beyond. Qucs is licensed under the GNU Public Licence (GPL). Current research activity is concentrating on the development of VHDL, Verilog and Verilog-A component models linked to C++ circuit simulator code via XML interfaces. Emerging CMOS, optical, thermal and mechanical technologies are also forcing new equation-defined device approaches to the software engineering of circuit simulators and component models.

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Mr Julian Callow

Julian Callow is Chief European Economist for Barclays Capital. Based in London, he manages a team of eleven economists responsible for analysing the European economy and monetary and fiscal policy.

Julian has been consistently ranked within the top five for Institutional Investor Surveys of European investors on an annual basis going back to 2000, coming third n the most recent 2008 European Fixed Income Survey. He has been a member of the “ECB Shadow Council”, an independent panel of economists convened by Handelsblatt that meets monthly to discuss ECB policy, since its formation in 2002.

Prior to working at Barclays Capital, Julian worked at Credit Suisse First Boston (1999-2003, where he was in charge of continental European economics and Co-Head of European Economics), Dresdner Kleinwort Benson (1992-99), Chase Manhattan (1990-92) and the Bank of England (1987-90, where he was responsible for analysing the economies and financial systems of North America). He graduated in 1987 from Oxford University with a First Class degree in Philosophy, Politics and Economics.

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Sebastian Cases

Sebastien Cases graduated in 1997 from Université Joseph Fourier, Grenoble, France with a Master of Science in Microelectronics. He worked as a consultant for STMicroelectronics from 1998 to 2000 on the development of IC design tools before joining the Design Automation Business Unit of MEMSCAP as an Application Manager for the MEMS design tools. He joined SoftMEMS in 2004 as an Application and R&D Manager. He is currently head of European operations at SoftMEMS since 2006.

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Ricardo de Sa Earp

Ricardo de Sa Earp is Group Vice President and General Manager of the Application Specific Discrete (ASD) & Integrated Passive and Active Devices (IPAD) Division within ST's Analog, Power, MEMS Group and has held this position since 2003.

De Sa Earp started his career with Philips Consumer Electronics in Sao Paulo, Brazil, working in TV design. In 1993, he moved to the Electronics Division of Valeo, where he held positions in marketing and project management. De Sa Earp joined ST in 1997 as Strategic Marketing Manager for Telecom, Computer & Automotive in the ASD & IPAD Division at ST Tours (France). In 2003, he was promoted to his current position, responsible for the management of five product families (Rectifiers, Thyristor/Triac, Protection, IPADs and New Energies).

Ricardo de Sa Earp was born in Petropolis, Brazil, in 1963. He graduated in Electronic Engineering from the Instituto Tecnologico de Aeronautica Sao Jose dos Campos, Brazil, and completed his Master’s Degree in Electronic Engineering at the Technical University of Eindhoven, Holland. De Sa Earp also holds an MBA from INSEAD in France.

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Mr. Paul Double

Paul Double is EDA Solutions founder and CEO. After gaining a B.Sc. Hons. in Physics and Electronics at the University of Warwick, UK, Paul started his career in IC Design with Phillips Semiconductors (now NXP), eventually moving into product management. Paul then spent eight years in Design Consultancy and EDA Software sales management, first with Rood Technology, then later with Acapella. It was at Acapella Paul first gained experience with the Tanner tools and came to fully appreciate the benefits of MPW services. In 2001 Paul founded EDA Solutions to further the interests of both Tanner and MOSIS throughout Europe. In this time Tanner’s sales in Europe have increase alomst 400%, with Tanner now a serious rival to the leading analog design tool providers.

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Prof. Christian Enz

Christian Enz is Vice President of the Swiss Center for Electronics and Microtechnology (CSEM SA) where he is heading the Integrated and Wireless Systems Division which is active in the design of ultralow-power SoCs. He is also Adjunct Professor at the Swiss Federal Institute of Technology, Lausanne (EPFL), where he is lecturing and supervising undergraduate and graduate students in the field of analog and RF IC design. Prior to joining the CSEM in 1999, he was Principal Senior Engineer at Conexant (formerly Rockwell Semiconductor Systems), Newport Beach, CA. From 1992 to 1997, he was an Assistant Professor at EPFL, working in the field of low-power analog CMOS IC design and device modeling. In 1989 he was one of the founders of Smart Silicon Systems S.A. (S3), a start-up company active in the design of low-noise and low-power analog ICs.

Christian has a long experience in the design of ultralow-power analog and RF integrated circuits, particularly RF CMOS radios for wireless sensor networks. He has also been active in the modeling of semiconductor devices and together with E. Vittoz and F. Krummenacher he is the developer of the EKV MOS transistor model used for low-power design. He is the author of the book "Charge-Based MOS Transistor Modeling - The EKV Model for Low-Power and RF IC Design", co-author of more than 140 scientific papers and has contributed to numerous conference presentations and advanced engineering courses.

He holds a MS and PhD degree from the Swiss Federal Institute of Technology, Lausanne (EPFL).

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Peter Frith

Peter Frith joined Wolfson as an analog circuit designer in 1985, initially designing custom mixed signals chips for many applications including communications, military, industrial and audio. From 1990 he lead a low power communications circuit design group, in 1996 transforming that group into the audio converter design group that produced Wolfson’s first standard audio DAC and Codec products. As this activity expanded, from 2000 he assumed responsibility for Wolfson’s New Product Definition activity and in 2006 was appointed CTO. He is currently tasked with adding further new technologies to Wolfson’s growing mixed signal chip portfolio.

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Dr. Helmut Gassel

Dr. Helmut Gassel joined Infineon in 1995 as Project Manager. After holding various management positions in Development and Marketing, incl. a 3 year assignment in the USA in the Automotive Market, he has joined the Chip Card & Security IC business in 2005. In January 2006 he took over the General Manager position for the Business Unit Chip Card & security ICs. As of October 2008 he has been assigned to the position of Division President Chip Card & Security.

Prior to this affiliation with Infineon he worked with the Fraunhofer Institute in the field of Semiconductor Technology Development. He holds a master degree in Physics and a PhD in Electrical Engineering.

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Wladek Grabinski

Wladek Grabinski received the Ph.D. degree from the Institute of Electron Technology, Warsaw, Poland, in 1991. From 1991 to 1998 he was a Research Assistant at the Integrated Systems Lab, ETH Zürich, Switzerland, supporting the CMOS and BiCMOS technology developments by electrical characterization of the processes and devices. From 1999 to 2000, he was with LEG, EPF Lausanne, and was engaged in the compact MOSFET model developments supporting numerical device simulation and parameter extraction. Later, he was a technical staff engineer at Motorola, and subsequently at Freescale Semiconductor, Geneva Modeling Center, Switzerland. He is now an consultant responsible for modeling, characterization and parameter extraction of MOS transistors for the design of RF CMOS circuits. He is currently consulting on the development of next-generation compact models for the 65–32-nm-technology very large scale integration (VLSI) circuit simulation. His current research interests are in high-frequency characterization, compact modeling and its Verilog-A standardization as well as device numerical simulations of MOSFETs for analog/RF low power applications. He is an editor of the reference modeling book "Transistor Level Modeling for Analog/RF IC Design" and also authored or coauthored more than 50 papers. Dr. Grabinski has served as a member in IEEE EDS Compact Modeling Committee and organization committee of ESSDERC/ESSDERC Conference. He is also involved in activities of the MOS-AK compact modeling group and serves as a coordinating manager since 1999.

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Yann Guillou

Yann Guillou is in charge of 3D Integration and Advanced Packaging within the CTO & Strategic Planning Office of ST-Ericsson. The function encompasses securing of mid and long term company packaging roadmap with appropriate level of innovation.

Yann started his carrier in CEA-LETI as R&D engineer. He joined the Wireless Multimedia Division of STMicroelectronics in 2007 and then successively worked at ST-NXP Wireless and ST-Ericsson.

He holds a MSc degree in Materials and NanoTechnology from the National Institute of Applied Sciences (France) and a Master in Management of Technology and Innovation from Grenoble Business School (France).

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Frédéric Haine

Frederic Haine, general manager Networking and Consumer segments Europe, is a 20-year semiconductor industry veteran. Frederic joint Freescale semiconductor (at that time Motorola) in 1995 where he served as Global Account Sales director, director of Sales for the Networking and Computing Systems Group Europe and Director of Application of sales for the Wireless and Broadband System Group.

Before joining Freescale in 1995, Frederic Haine occupied several positions of increasing responsibility in operations, marketing and sales at Thomson semiconductor in France and Harris semiconductor (now Intersil) in the United States.

Frederic Haine holds a master of sciences from Ecole Centrale de Paris-France.

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Jack Harding

Jack Harding is president and CEO of eSilicon Corporation and brings more than 25 years of management experience spanning the semiconductor and EDA sectors. Mr. Harding co-founded eSilicon in 2000 and is responsible for eSilicon overall leadership, strategy and management. Several years ago, Mr. Harding introduced a new business model called the Value Chain Producer (VCP) that is today a $1B market segment. In 2009, the Global Semiconductor Alliance (GSA) recognized this new market segment by creating a VCP Board seat.

Mr. Harding is currently on the Board of Directors of RF Micro Devices (NASDAQ: RFMD) and Global Semiconductor Alliance (GSA) in addition to being the Chairman of eSilicon Corporation

Prior to eSilicon, he served as president and CEO of Cadence during which time Cadence achieved the status of world’s largest supplier of EDA software and provided the greatest shareholder value in the history of that company. Mr. Harding entered Cadence upon the acquisition of Cooper & Chyan Technology (CCT), where he served as the president and CEO, and was responsible for leading the company to an IPO. Prior to CCT, Mr. Harding served as the executive vice president of Zycad Corporation. Mr. Harding began his career at IBM.

Mr. Harding has held various directorships in both public and private organizations and served as a member of the prestigious Steering Committee at the U.S. Council on Competiveness and was a National Academies' Committee member for Software, Growth and the Future of the U.S. Economy.

Mr. Harding is a frequent international speaker on the topics of innovation, entrepreneurship and semiconductor trends and policies. He holds a B.A. from Drew University in Chemistry and Economics and attended the Stern School of Business at New York University.

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Mr. Michel Hordies

Michel Hordies graduated in 1979 from Ecole Centrale des Arts et Métiers in Brussels (Belgium). He holds an MSc in Industrial Engineering in Electronics.

Michel spent the first 15 years of his career in the Information Technology & Telecommunications industry occupying various positions where he developed his expertise on many aspects of the electronics technologies and business: hardware/software development, project management, and management in an international environment.

Since 1994, Michel works at the European Commission where he started in the trans-European networks programme. Since 1998, he is involved in the research programmes on Information & Communication Technologies. He is currently Scientific Officer in the field of nanoelectronics in DG Information Society and Media.

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Heinz Kundert

Heinz Kundert was named president of SEMI Europe in October 2005. Kundert has been within the semiconductor industry for 23 years when he joined Balzers in Liechtenstein, a global supplier of thin film equipment. In total he lived more than five years in Asia before he became COO of the newly formed company Unaxis that was a merger between Balzers and Leybold. From 2002 Kundert was named CEO of Unaxis. Kundert has a degree in mechanical engineering and business administration with a federal diploma from the FAH/University of St. Gallen, Switzerland.

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Loic Lietar

Loïc Liétar is an Executive Vice President and Chief Strategic Officer of STMicroelectronics, and has held this position since January 2008. He is responsible for the Company’s Strategic Planning, Corporate Business Development, and Corporate Communication (since February 2010). Liétar is a member of ST’s Corporate Strategic Committee and also sits on the Board of Directors of ST-Ericsson.

Liétar joined Thomson Semiconducteurs, a predecessor company to STMicroelectronics, in 1985. After working in R&D Management and marketing, he was appointed Director of the Company’s Advanced Systems Technology labs in the US in 1999. Four years later, Liétar became General Manager of ST’s Cellular Terminals Division, and later moved to head the Application Processor Division. Appointed Group Vice President, Strategies in 2006, he contributed to deconsolidating ST’s Flash memory business, as well as establishing the R&D partnership with IBM and creating ST- Ericsson, the wireless joint venture with Ericsson. Liétar sits on the Board of Directors of the Global Semiconductor Alliance. In April 2010, he was elected President of the Minalogic micro-nanotechnology cluster in Grenoble, France.

Loïc Liétar was born in Paris, France, in 1962. He graduated with degrees in Engineering and Microelectronics from the École Polytechnique and Orsay University in Paris, respectively, and holds an MBA from Columbia University, New York.

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Andreas Melder

Andy joined Gigle Networks in November 2009 and serves as the company’s vice president of business development. Andy has more than 30 years of experience working with technology leaders in the fast-growing consumer broadband communications and connected home markets. He has helped six companies achieve successful financial exits (three of them, IPOs over the past 10 years), either as a co-founder or member of the executive leadership team. Melder also advised and was an investor in Flarion a wireless telecommunications infrastructure enterprise, having successfully been acquired by Qualcomm in 2006. Prior to joining Gigle Networks, Melder held the SVP Sales, Marketing and Business Development position at Intellon, which led up to the company's 2007 initial public offering – now having been recently acquired by Atheros Communications. Prior to Intellon, Melder co-founded Microtune, Inc. (NASDAQ: TUNE), where he served as vice president of sales and marketing. After Microtune, Melder served as vice president of sales, marketing and corporate business development at Tripath Technologies, and was a member of the leadership team that executed the company's successful public offering. Melder holds a Bachelor of Science degree in Electrical Engineering and Business from Carnegie-Mellon University in Pittsburgh, and a Master of Science degree in Operations Research and Electrical Engineering from Southern Methodist University in Dallas.

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Slobodan Mijalković

Slobodan Mijalković received the Ph.D. degree in microelectronics from the University of Niš (Yugoslavia) in 1991. From 1991 until 1998 he was with the Faculty of Electronics Engineering, University of Niš, as Assistant and Associate Professor at the Department of Microelectronics. In 1995 and 1996 he was a Guest Researcher at German National Center for Information Technology (GMD). From 1998 until 2006 he was with Delft Institute of Microelectronics and Submicron Technology (DIMES) in the Netherlands as a senior researcher and leader of the compact modeling group supporting Mextram model for the Compact Model Council (CMC). Since 2006, he is with Silvaco Europe (Cambridge, UK), as a senior development engineer specialized in compact modeling for analog and digital circuit design. Slobodan Mijalković is a Senior Member of IEEE.

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Mr. Douglas Pattullo

Douglas Pattullo is TSMC’s Director of Technical Support for Europe with responsibility for supporting customers during their complete design process from initial contact right through to GDSII tape-out. Together with his team, Douglas provides technology information to customers, as well as support and guidance on topics such as process selection, modelling, EDA tools, DFM and the availability of IP.

With a remit covering geometries from 28nm up to 1um and technologies as divergent as logic, mixed-signal, RF, HV and MEMS; he interacts with a customer base that includes both large multi-national corporations as well as small innovative start ups. His daily work is to enable European companies to solve both the challenges posed by “Moore’s Law” as well as to help create “More than Moore” innovations.

Before joining TSMC, Douglas graduated in 1988 from University College, London with first class honours and has worked for various companies. He initially spent 6 years learning the ropes as an analogue designer before moving into Design support with a responsibility for automation, methodology and PDK development but always with a focus on supporting Analogue, Mixed-Signal and RF Designers. Douglas has worked for TSMC since 2005.

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Michael Pronath

Michael holds a PhD in Electrical Engineering from the Technical University of Munich. He is author and coauthor of several international publications about methods of analog integrated circuit design and testing of mixed-signal circuits.

Michael cofounded MunEDA in 2001. The Munich-based company creates EDA software solutions for circuit sizing and design centering. MunEDA's main product WiCkeD is used to improve performance and robustness of designs for wireless communication, memory, automotive, and full-custom digital design.

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Brian Robertson

Brian Robertson joined DSP Group Inc. in 2007, following the acquisition of the cordless activities of NXP Semiconductors BV, where he had served as VP & GM of the acquired business line. Becoming President of DSP Group Inc. in October 2007, Brian led the company's product development activities, integrating the development and marketing groups post-acquisition up to the middle of 2009. Brian is currently responsible for the European activities of the company.

Brian has spent over 5 years in Asia, leading marketing and sales for a wide portfolio of semiconductor and software products throughout the region.

Prior to his time in Asia, Brian held various product development and management positions for Philips Semiconductors in Switzerland, France and Germany, following 2 years in research at Bell Northern Research in the United Kingdom.

Brian holds a B.Eng (Hons) degree in Electronics Engineering from the University of Bristol and a post-graduate Diploma in Business from the University of Strathclyde.

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Joshua Rom

Joshua Rom serves as the Managing Director of Virage Logic's Netherlands B.V. entity and as General Manager of the company's Analog Business Unit. In these roles, Rom is responsible for leading all operational aspects of the company's Netherlands' R&D center of excellence, establishing a thriving new Analog business unit and furthering the company's longstanding successful partnership with NXP Semiconductors.

Prior to joining Virage Logic in November 2009, Rom was a consultant to several companies on a wide variety of topics from yield improvement to mergers and acquisitions. As a semiconductor industry veteran with more than 30 years of experience in the field, Rom was the first vice president of operations at Ikanos Communications where he was instrumental in taking this venture from a start-up to a $150M company over a three-year period. Rom also served as a director of engineering at Broadcom Corp., spearheading the success of its Switching line of business.

Rom has held a number of other engineering and operations management roles in the semiconductor industry for companies such as MMC Networks, Silicon Light Machines, Adaptec and WaferScale Integration (WSI).

Rom holds an MBA from San Jose State University, California and a B.Sc.E.E. from Tel-Aviv University in Tel-Aviv, Israel.

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Jodi Shelton

Jodi Shelton is the co- founder and president of GSA. A pioneer within the technology space, Shelton masterminded the creation of the Alliance and has continuously addressed global issues in the industry as the voice of its members. Under her leadership, GSA has grown to include more than 500 corporate members from across the globe, united in improving the image and credibility of the fabless ecosystem. In her role as executive director Shelton oversees GSA daily operations, ensuring that the Alliance remains focused on achieving its defined vision and goals. She acts as the key liaison between GSA and the business community at high-level financial and industry conferences, providing insight on key topics pertaining to the global fabless supply chain. Some of Shelton’s recent accomplishments include ringing the closing bell at NASDAQ and seamlessly transitioning the Fabless Semiconductor Association (FSA) to the Global Semiconductor Alliance (GSA) in 2007. Shelton earned her bachelor’s degree in political science from San Diego State University and her master’s degree in political science from the University of Houston.

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Dr. Mike Short

Dr. Mike Short's career spans 33 years in electronics and telecommunications, with the last 20 years in mobile communications. He was elected Chairman of the GSM Association for 1995/96 and served on its executive board for 5 years. He has also served as a member of the UK Home Office Internet Task Force and UK OSAB (Ofcom Spectrum Advisory Board) until 2006 and 2007 respectively.

He was appointed VP Technology for O2 Group in 2000, visiting professor at Surrey University in 2003 and to the Coventry University Board in 2006. He is a Fellow of BCS, CIPS, IET and RGS, and a member of the Royal Television Society. Mike's focus today is on third generation cellular, mobile TV and steering Telefonica O2 Europe’s Group Research and Development in mobile communications.

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Roy Starr

Roy Starr is Sales Manager of North West Europe region for X-FAB Semiconductor Foundries. He started his career in 1983 at Plessey Semiconductors as a Technology development engineer focusing on areas of characterization and design support. He joined Inmos in 1988 leading the Device Physics TCAD Modelling group and subsequently also worked with GEC-Plessey, Mitel & Zarlink as foundry outsourcing technical interface and later in foundry sales. He holds an honours degree in Electronics & Microcomputer Systems from Dundee University.

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Dr. Gerd Teepe

GLOBALFOUNDRIES was launched in March 2009 through a partnership between AMD and the Advanced Technology Investment Company (ATIC). With the integration of Chartered Semiconductor in January 2010, GLOBALFOUNDRIES significantly expanded its capacity and ability to provide best-in-class foundry services from mainstream to the leading edge.

Dr. Gerd Teepe is Director Digital Design, based at GLOBALFOUNDRIES’ multi-billion dollar manufacturing facility in Dresden, Germany, and is responsible for leading edge design solutions in view to provide enhanced design enablement product offerings.

Dr. Teepe has been with the corporation and its predecessor company AMD for 6 years, serving in multiple R&D roles, each focused on keeping the company’s semiconductor technologies at the forefront of performance, power-efficiency and manufacturability. He has published more than 50 scientific papers. In addition he is vice-chairman of the GMM, the joint microelectronics section of the German engineering organizations VDE and VDI.

Dr. Teepe studied electrical engineering at the RWTH Aachen University, Germany, concluding with a PhD in 1986. Since then he has been with the semiconductor industry, first with NEC in Tokyo, Japan, where he carried out research in fault-tolerant micro-architectures. Before joining AMD in 2004, Dr. Teepe has been with Motorola-Semiconductors in the following functions: IC-Design Engineering, IC-Design Management, as well as Marketing- and Operations Management. In his last position he was heading the “Strategy and Advanced Developments Labs” in Munich and Detroit, chartered to develop the strategy for the automotive business unit with 1.5 B$ of sales at that time. In his career with Motorola, Dr. Teepe has been working out of Geneva, Toulouse and Munich with global reporting.

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Matthew Towers

Matthew graduated in 1986 with a Masters in electrical and electronic engineering from Nottingham University in the UK. He started his career at Texas Instruments where he worked in various semiconductor sales and marketing positions during a three year period.

In 1989, Matthew founded IMS Research, which has since grown organically into a 100 person organisation across three continents, publishing more than 200 market reports every year. He retains overall responsibility for the worldwide operations of IMS Research, which produces detailed market intelligence on technology markets ranging from consumer electronics to medical equipment and renewable energy. IMS Research is now one of the leading global market analyst firms servicing the semiconductor industry.

During his time with IMS Research, Matthew has worked as a senior analyst in a variety of industries including semiconductors, wireless communications, power electronics, and consumer appliances, providing consultancy services and producing detailed market reports. In recent years, he has been particularly closely involved in the industrial oriented sectors at IMS Research, including power/energy, medical, security and automation.

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Joep van Beurden

Mr. van Beurden was appointed Chief Executive Officer of CSR on 1 November 2007. Mr. van Beurden has over ten years of experience in managing technology companies in the US and Europe. For the three years prior to joining CSR, he was Chief Executive of NexWave Inc., a provider of embedded software solutions for the consumer electronics market based in France. Before joining NexWave, Mr. van Beurden held senior positions at Canesta Inc., a fabless semiconductor company, and Philips Components. Whilst at Philips, he was part of the executive team which established a successful consumer electronics joint venture with LGE. Prior to that, Mr. van Beurden worked for five years for management and strategy consultants McKinsey & Company. Mr. van Beurden has also worked as a crude oil trader for Royal Dutch Shell in Rotterdam and lectured in Physics and Electronics at the University of Zambia. Mr. van Beurden holds a Masters degree in Applied Physics from Twente University of Technology in Enschede, the Netherlands.

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Ciaran Whyte

Ciaran Whyte is a co-founder & CTO of IC Mask Design. He has over 16 years experience in the semiconductor industry, beginning his career as one of the first members of the physical design team of Parthus technologies, which grew to 30 engineers, spanning 5 geological locations servicing a design team of almost 500 engineers.

In 2002, Ciaran founded IC Mask Design, a physical design services company, focused on providing expert design services, consultancy and training to the semiconductor design industry. More recently he has architected & developed IC Mask Designs analog layout acceleration tool.

Since it's inception, IC Mask Design has serviced over 90 customers world wide, taping out over 100 designs.

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